Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of process control tools that perform macro defect inspections and metrology, lithography systems, and process control analytical software used by semiconductor and advanced packaging device manufacturers. Rudolph's proprietary products offer comprehensive solutions for all phases/segments of the semiconductor fabrication process. Our products that provide critical yield-enhancing information, which is used by microelectronic device manufacturers to drive down costs and to decrease the time to market of their devices. We provide process and yield management solutions used in bare silicon wafer production and wafer processing facilities, often referred to as "front-end" manufacturing and device packaging and test facilities, (or "back-end" manufacturing), respectively through a portfolio of standalone systems for macro-defect inspection, packaging lithography, probe card test and analysis, as well as transparent and opaque thin film measurements. All Rudolph systems feature sophisticated software and production-worthy automation. In addition, our advanced process control software portfolio includes powerful solutions for standalone tools, groups of tools, factory-wide, and enterprise-wide suites to enhance productivity and achieve significant cost savings. Rudolph's systems are backed by worldwide customer service and applications support.
These newly released products supplement Rudolph's established product portfolio of extensive 2D and 3D process control solutions for a variety of device types of advanced packaging, such as second generation high bandwidth memory ("HBM2") devices, double data rate Dynamic Random Access Memory ("DRAM") (DDR4 and DDR5), 3D Not And ("NAND") memory, advanced packaging for radio frequency ("RF") modules, Complimentary Metaloxide Semiconductor ("CMOS") image sensors, Microelectromechanical Systems ("MEMs"), etc. that are used in smartphones, wearable devices, tablets and personal computers, automotive, Internet of Things ("IoT") and others. The need for more process monitoring and control continues to increase for semiconductor and related industries as the required levels of quality and reliability continue to rise. Predictive analytics can lower maintenance costs, rate of scrap wafers, unscheduled tool downtime and material costs. Rudolph's established fault detection and classification software, which is also incorporated into tools manufactured by others companies, allows customers to seamlessly turn equipment data into actionable operational information. This collaboration is designed to enhance etch and deposition tool performance.
Advanced Packaging refers to a variety of technologies that enable the miniaturization of electronic products, such as portable consumer devices, including smartphones, watches, and tablets. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which a single circuit made from semiconducting material (a die or chip) is encased in a molded package that provides external connections to a printed circuit board and also prevents physical damage to the chip and corrosion. Advanced Packaging refers loosely to the conductors and other structures that often interconnect multiple die, feed them with electric power and create signal paths to and from the PC board, dissipate their heat, and protect them from damage. Today, the drive to pack more functions into a small space and reduce their power requirements demands that chip packages do much more than ever before to combine multiple functions into a single molded package.